Ricky Zang

Ricky Zang is a seasoned professional with extensive experience in advanced packaging development. Currently serving as Senior Director at Amkor Technology, Inc. since October 2018, Ricky Zang focuses on business expansion in Greater China by integrating various engineering disciplines and strategies to enhance growth. Previously, as Principal Manager at Qualcomm from April 2006 to October 2018, Ricky Zang was responsible for the introduction of new products in IC packaging across multiple foundries and OSATs, significantly contributing to the company's growth in technology and production. Earlier roles include Packaging Engineer positions at Microchip Technology Inc. and ASE Group Global, where Ricky Zang specialized in high-performance package design and customer collaboration. Ricky Zang holds a Bachelor of Science degree in Electrical Engineering from Old Dominion University.