Ilko Schmadlak

Ilko Schmadlak is a seasoned professional in mechanical and thermal modeling with extensive experience in the semiconductor and electronics industries. Currently serving as a Senior Technical Account Manager at Ansys since October 2018, Ilko previously held positions as a Principal Engineer at NXP Semiconductors, focusing on thermal and mechanical modeling for electronic packaging, and as a Senior Engineer following NXP’s acquisition of Freescale Semiconductor. Early career experience includes a Mechanical Engineer role at Motorola. Throughout these roles, Ilko has successfully conducted mechanical risk assessments, developed enhanced modeling techniques, and contributed to numerous IEEE technical papers and patents. Ilko holds a Diplom Ingenieur in Mechanical Engineering from the University of Applied Sciences Dresden.