Didem Turker Melek

Didem Turker Melek serves as the Design Engineering Group Director at Cadence Design Systems within the Silicon Solutions Group since September 2021, previously holding the role of Design Engineering Director. In addition to responsibilities at Cadence, Didem Turker Melek contributes to the International Solid-State Circuits Conference (ISSCC) as a Wireline Subcommittee Member and holds key positions such as ISSCC 2024 Session Chair and Forum Co-Organizer for wireline discussions. Notably, Didem Turker Melek organized the ISSCC 2023 Forum and currently acts as the General Chair for the Cadence Innovation Conference (CIC) 2025. Didem Turker Melek also played a significant role in the Cadence Women's Conference 2023 as a Track Lead and Program Committee Member. With prior experience at Xilinx as a Senior Design Manager and a strong academic background, including a PhD in Electrical Engineering from Texas A&M University, Didem Turker Melek has built expertise in high-speed wireline transceiver circuits and analog mixed signal circuit design.