STATS ChipPAC
Nokibul Islam possesses over 20 years of extensive experience in semiconductor packaging assembly technology, product development, and management, currently serving as the Senior Director of Worldwide Field Application Engineering at JCET Group Co., Ltd. since May 2011. Importantly, Nokibul has a proven history of optimizing assembly processes and innovative engineering, achieving significant cost reductions and rapid qualification of advanced technologies. Expertise includes electronic packaging assembly, program management, mechanical and thermal simulation, and failure analysis, alongside a strong ability to manage customer relationships and supply chain dynamics. Prior experience includes a role as Staff Engineer at Amkor Technology, with a PhD in Mechanical Engineering focused on Electronic Packaging from Auburn University.
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STATS ChipPAC
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.