Edison Siu is currently unknown role at University of Southern California. From June 2016 to August 2016, they were an Assembly Technology Development (ATD) Intern at Intel Corporation where they developed a low-cost infrared camera to analyze excess solder flux on substrates representing an over $9,000 reduction in cost compared with commercially available systems.
Edison Siu completed a Bachelor of Engineering (BE) in Computer Engineering Computer Science at the University of Southern California, followed by a Bachelor of Engineering in Electrical and Electronics Engineering at Ira A. Fulton Schools of Engineering at Arizona State University. Edison also attended Phoenix Country Day School.
Current role