Jim Smith

Principal, Modular Hardware Architect (v) at 3D Systems

Jim Smith has a diverse work experience, starting as an Engineering Intern at Aeroflex Laboratories, Motion Control Division in 2007. Jim then worked as an Equipment Mechanical Engineer at IBM, Systems & Technology Group in 2010. Following this, they transitioned to 3D Systems Corporation in 2011, where they held roles as a Senior Systems Design Engineer, Specialist Mechanical Design Engineer, and currently as a Principal Modular Hardware Architect. Jim'sresponsibilities varied from leading systems engineering projects to managing technical programs and designing key performance systems for 3D printers.

Jim Smith completed their Bachelor of Science in Mechanical Engineering at Rensselaer Polytechnic Institute in 2009. Jim then went on to pursue a Master of Engineering in Mechanical Engineering at Cornell University in 2010.

Links

Previous companies

IBM logo

Timeline

  • Principal, Modular Hardware Architect (v)

    2022 - present

  • Specialist, Mechanical Design Engineer (iv)

    2019

  • Senior Systems Design Engineer (iii)

    2011

View in org chart