3DiS Technologies is a service provider of semiconductor packaging design and assembly using an innovating 3D interconnect technology. This technology enables high performance 3D inductive passive device implementation beside or above IC, as well.  Based on a reduced number of technological steps and perfectly adaptable to the constraints of the client's application, the proposed process is ideal for System-in-Package, Wafer-Level-Packaging and above-IC inductive device integration. Our cost effective solution reduces time-to-market and leads to miniaturized and more efficient electronic systems.

3DiS Technologies

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