Adrian Mardari has a strong background in engineering and technology, holding a Bachelor's Degree in ICT Engineering from VIA University College and a Master of Science in Computer Engineering from the Technical University of Denmark. Experience includes a role as a Student Assistant in the Chipset/Firmware team at Oticon from August 2017 to June 2019, as well as being an IC Design Engineer during an internship at VIA University College in early 2015. Adrian has served as a Student Instructor at 3Shape since August 2023 and worked as an Electronics Engineer intern at Siemens from February to July 2016. Additionally, experience includes participation in the Finance Department at AIESEC Denmark in 2014.
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