Roy Lee is a skilled manager and engineer specializing in 2D/3D metrology and inspection process development, with extensive experience in semiconductor packaging substrates. They served as Deputy General Manager at Fine Semitech Corp. from 2022 to 2023, focusing on the development of inspection equipment for glass wafers. Currently, Roy holds the position of Manager at Absolics Inc., where they oversee investment, operation, and management of back-end processes for glass substrate packaging. Previous roles include Senior Engineer positions at both PIXEL and Samsung Electro-Mechanics, where they developed critical technologies for semiconductor packaging. Roy earned a Master’s degree in Electronic Engineering from 광운대학교 in 2008.
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