Chiou Bill is a seasoned Technical Director with over 15 years of experience in the camera module assembly field and more than 25 years in semiconductor packaging. Chiou has demonstrated expertise in substrate design, mechanical design, and assembly processes while leading various engineering teams. Previously, Chiou served as Executive VP at IMAGIC TECHNOLOGIES, overseeing factory management and project direction. Chiou earned a Bachelor of Science in Power Mechanical Engineering from National Tsing Hua University and a Master of Science in Mechanical Engineering from National Taiwan University. Currently, Chiou is focused on semiconductor packages, including DRAM WBGA and flip chip technologies at ADATA Brazil S/A and ADATA Technology Co., Ltd.
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