Brian Parten is a Client Platform Architect and Fellow at AMD, where they have worked since 2019. With extensive expertise in USB Type-C technologies, PC architecture, and various wireless technologies, Brian has a solid background in embedded systems and semiconductor processing. Prior to their current role, they held multiple engineering positions at Texas Instruments from 2008 to 2010 and completed a co-op at Lockheed Martin Aeronautics in 2002-2003. Brian earned both a Bachelor's degree in Computer Engineering and a Master's degree in Electrical Engineering from Texas Tech University.
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