Coco (Fang yu) Liang is a Senior Member of Technical Staff at AMD, specializing in advanced IC packaging. With extensive experience as an R&D integration engineer, they have worked at multiple companies, including TSMC and 矽品精密工業股份有限公司, focusing on integrated fan-out and 2.5D IC technologies. Coco holds a Master’s degree in Mechanical Engineering from National Taiwan University and has authored seven patents related to advanced packaging structures. Currently, they continue to contribute to technology development while enjoying collaboration across cross-functional teams.
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