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Conti Chen

TD SMTS Packaging Engineer

Conti Chen is a TD SMTS Packaging Engineer at AMD, where they lead substrate path finding and manage the development of substrate technology and future roadmaps. Prior to this, Conti held roles including R&D Deputy Section Manager at Matsuki Polymer Technology Co., Ltd. and R&D Senior Deputy Manager at 欣興電子, focusing on various aspects of technology development and yield improvements. They began their career as a Deputy Researcher at Taiwan Textile Research Institute, where they contributed to the development of natural polymer applications. Conti earned a Bachelor's degree and a Master's degree in Chemical Engineering from National Chung Cheng University, graduating with a GPA of 3.93.

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