Daniel McLean is an experienced design engineer currently serving as the Design Lead at AMD since 2018, specializing in chiplet interconnects and RTL automation. Previously, they were the CTO at Per Vices Corporation from 2014 to 2018, where they led efforts in developing high-performance software-defined radios. Daniel began their career with a brief role as a Hardware Engineer at AGFA Graphics/Gandinnovations in 2014, after completing a Bachelor of Applied Science in Computer Engineering at Queens University in 2013. A lifelong learner, they possess proven expertise in ASIC, FPGA, and PCB design, as well as communications systems.
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