Daniel Ng is a Fellow in Advanced Packaging at AMD, where they apply their expertise in the semiconductors industry. Previously, they served as PMTS in Advanced Packaging at AMD, Operation Quality Manager at STMicroelectronics, RD Department Manager at SPIL, and Senior Packaging Engineer at Intel Corporation. Daniel holds a Doctor of Philosophy in Mechanical Engineering from Imperial College London, earned in 2002, and possesses strong skills in statistical data analysis, assembly processes, process integration, project management, and supplier management.
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