Dongming He

Dongming Dongming is the Director of Advanced Packaging and Heterogeneous Integration at AMD, a position held since 2025. Previously, Dongming served as the Director of Package Process and Technology at Qualcomm from 2011 to 2025, where they focused on advanced package development across various sectors. Prior to that, they worked at Intel Corporation from 2001 to 2007 in roles including Staff Silicon and Package Integration Engineer and Senior Staff Product Quality and Reliability Engineer. Dongming earned a PhD in Microelectromechanical Systems from the University of Illinois at Urbana-Champaign and is currently pursuing undergraduate and graduate degrees in Mechanical Engineering and Electrical Engineering from Tsinghua University.