Eric Yong is a Senior Manager at AMD with 18 years of experience in IC packaging, reliability, metrology, and characterization. They lead a high-performance team focused on package, board, and system reliability, while managing operations at the reliability engineering lab in Singapore. Previously, they held roles at Infineon Technologies and Intel Corporation, contributing to significant advancements in packaging technology. Eric is currently pursuing a PhD in Mechanical Engineering at the University of Bath.
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