Ethan Chen is a Director of 3D Advanced Packaging at AMD, where they lead the strategy and execution of 3D advanced packaging technologies, focusing on chiplet integration and vertical interconnect architectures. Previously, Ethan worked at Intel for several years in various roles, including Packaging Engineer and Senior Technical Program Manager, where they contributed to performance and manufacturability and oversaw advanced packaging integration. Currently, Ethan pursues a Master of Science in Electrical Engineering with a specialization in Microelectronics and Systems at UC Irvine, alongside a Bachelor of Science in Materials Science and Engineering from UC Davis.
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