James Tan

James Tan is a Senior Member of Technical Staff specializing in substrate design at AMD, where they design flipchip substrates for processors including CPUs, GPUs, and APUs. With over a decade of experience in wirebond and flipchip, as well as leadframe and substrate design, James has demonstrated proficiency in AutoCAD and Cadence APD and has contributed to the design of various high-performance devices. Prior to AMD, they worked for UTAC as a Senior Design Engineer, supporting substrate and leadframe design while providing design training to colleagues. James began their career as an Assistant Engineer at Advanced System Automation Ltd, focusing on mold flow analysis and tooling design. They hold a Bachelor's Degree in Business Studies with a focus on Logistics and Supply Chain Management from University College Dublin and a Diploma in Manufacturing Engineering from Nanyang Polytechnic.