Lee Eisen is a Senior Fellow Silicon Design Engineer at AMD, focusing on core architecture in the Cores group since 2021. Previously, they served as a Senior Principal Engineer and Distinguished Engineer at Arm, where they led architectural prototype teams and contributed significantly to the SVE architecture and the Morello core. With a background at IBM spanning from 2001 to 2007, Lee held various senior roles, including core power lead and core architect for multiple processors. They earned a Bachelor of Science in Electrical Engineering from Texas A&M University in 1992 and hold 31 issued patents in their field.
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