Liwei Wang is a Senior Director specializing in 3D Advanced Packaging at AMD, with a notable history at Intel Corporation from 2017 to 2019, where they held various senior technical program management roles focusing on 2.5D/3D packaging integration and technology alignment for diverse product lines. They earned a Ph.D. in Materials Science and Engineering from Auburn University and a Bachelor's degree in the same field from East China University of Science and Technology. With extensive experience in packaging technology and materials optimization, Liwei actively contributes to advancements in semiconductor technologies.
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