Patrick Cheng is a skilled packaging engineer with extensive experience in advanced technology and semiconductor manufacturing. Currently serving as a Senior Member of Technical Staff at AMD since August 2018, Patrick has focused on the introduction and mass production of 3DIC (3D V-Cache) technology, driving yield improvement and factory readiness. Previously, as a Member of Technical Staff, Patrick developed and delivered the industry's first 3DIC product and worked on process integration. Earlier positions include being a Senior Packaging Engineer at AMD, contributing to the introduction of the EFB (Elevated Fan Out Bridge) product, and an Engineer at TSMC, where Patrick managed the development of the InFO packaging. Patrick holds a Master of Science in Materials Science and Engineering from Texas A&M University, earned between 2012 and 2014.
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