杨翰森

Sr.Silicon Design Engineer

翰森 杨 is a Sr. Silicon Design Engineer at AMD, a role they have held since 2021. Previously, they worked as an Application Engineer at 泰瑞达 from 2016 to 2018, focusing on Serdes chip testing and development. From 2018 to 2021, they were involved in embedded software and prototype validation at 复旦微电子, where they worked on various projects including FPGA prototype validation and Linux driver development.

Location

Yangpu District, China


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