Ryan Kinnerk

Ryan Kinnerk is a seasoned professional in RFSoC physical design, currently serving as the Principal RFSoC Physical Design Lead/Manager at AMD since February 2022, following a tenure as Senior Staff RFSoC Physical Design Lead/Manager. Previously, Ryan held similar roles at Xilinx and contributed significantly to advanced digital IC design as an Adjunct Lecturer at University College Cork. Ryan has extensive experience in physical design, implementation, and verification of complex low power mixed signal RF designs at varying technology nodes. Key areas of expertise include signoff STA, signoff Power/EMIR, and scripting in Perl and TCL. Ryan’s background includes roles at leading companies such as Analog Devices, XMOS, CEVA, Inc., 3Com, and Siemens, accompanied by a Master’s degree from University College Cork and a Bachelor’s degree from University of Galway.