TH Lai is a seasoned engineering professional specializing in ASIC and FPGA SOC architecture, transceivers, and IPs. Currently serving as the Director of Engineering at AMD, TH has a rich history of leadership and innovation, having previously held key roles at Intel Corporation, Altera, and various startups. Notably, from 2018 to 2022, TH managed complex ASIC and FPGA designs for APAC customers at Intel, ensuring seamless design implementation and debugging. In earlier roles at Altera, TH led a team providing technical support and authored multiple FPGA device handbooks, demonstrating a strong commitment to advancing technology within the industry.
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