Wei Yao is a demonstrated Modeling Engineer with over 10 years of experience in semiconductor device compact modeling. Currently, Wei holds the position of Principal Member of Technical Staff at AMD, having previously served as a Senior Member of Technical Staff. Wei's past roles include SPICE Modeling Engineer at Xilinx, where they developed and evaluated SPICE models for advanced CMOS technologies, and Device Modeling Engineer at Freescale Semiconductor, focusing on MOSFET compact modeling. Wei earned a Ph.D. in Electrical and Electronics Engineering from Arizona State University and holds a Master’s degree from the Shanghai Institute of Metallurgy.
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