Yip Seng Low

Yip Seng (YS) Low is the FCBGA BU Director at Amkor Technology, Inc., where they manage semiconductor packaging development and outsourced manufacturing. With extensive experience in 2.5D package development and reliability qualification, YS has held various engineering leadership roles at companies such as Motorola Semiconductor, AMD, Agilent Technologies, ASAT, and STMicroelectronics. They possess specialties in advanced flip chip package development, package reliability, and assembly development. YS holds a Master of Science degree in Mechanical Engineering from Iowa State University, complemented by a strong academic record.