Hairo Hu is a diligent Optical Module Package Process Engineer with extensive experience in high-tech industries focused on optical modules and advanced packaging. Hairo has worked with major tech companies, startups, and contract manufacturers, managing engineering teams and leading projects from engineering to mass production. Fluent in Mandarin, English, and Taiwanese, Hairo has contributed to various innovative projects, including camera modules for autonomous vehicles and advanced laser optical packages. Currently, Hairo is a Staff Optical Package Alignment Engineer at Aeva, specializing in the design and development of advanced laser optical package alignment processes. Hairo holds a Bachelor's degree in Mechanical Engineering from Hsinchu Ming Shin.
Location
Cupertino, United States
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