Lejun Wang

Lejun Wang has extensive work experience in semiconductor packaging engineering. Lejun has worked at various companies, starting with Intel Corporation in 2001, where they led underfill process development for Intel's next-generation CPU, chip set, and network processor products. Lejun then worked at Medtronic as a Senior Principal Packaging Engineer, leading cross-functional teams to resolve assembly issues and improve assembly yield for new defibrillator products. At Qualcomm, they served as a Senior Staff Engineer, leading packaging NPI activities and driving package technology development for cellular modem products. Lejun joined Analog Devices in 2019 as a Semiconductor Packaging Engineer and is currently working at Allegro MicroSystems as a Senior Principal Packaging Engineer.

Lejun Wang has a Ph.D. in Materials Science & Engineering from Georgia Institute of Technology, earned from 1996 to 2001. Prior to that, they obtained an MS in Polymer Engineering from Georgia Institute of Technology from 1994 to 1996. Before attending Georgia Tech, they completed an MS in Polymer Chemistry from Peking University from 1991 to 1994, and a BS in Chemistry from Peking University from 1987 to 1991. Additionally, Lejun Wang holds certifications as a Lean Sigma Green Belt and Six Sigma Black Belt, although the institutions and dates of these certifications are not provided.