Prem CS is an experienced IC Packaging Engineer specializing in advanced wafer-level packaging and semiconductor assembly. They previously managed MEMS process integration and qualification at GlobalFoundries and led MEMS and optical sensor packaging initiatives at the Institute of Microelectronics. Currently serving as a Principal Engineer at Allegro MicroSystems, Prem develops chip-package interaction reliability strategies for automotive products, ensuring compliance with industry standards. They are pursuing a Master of Engineering in Microelectronics at the Indian Institute of Technology, Madras, and a Master of Science in Engineering Physics at the University of Kerala, Thiruvananthapuram.
This person is not in the org chart
This person is not in any teams
This person is not in any offices