Sameer Dhandarphale is a packaging engineer with a Master's degree in Mechanical Engineering from the University of Texas at Arlington, where they graduated in May 2020. They have held positions at notable companies, including Micron Technology as a Reliability Engineer and currently at Celestial AI as a Packaging Engineer. Sameer has experience in reliability testing, thermomechanical simulations, and data analysis, alongside a strong background in 3-D modeling and finite element analysis gained as a Graduate Research Assistant at the Electronics, MEMS & Nanoelectronics Systems Packaging Center. Their expertise extends to designing mechanical and thermal solutions and vendor management within the semiconductor packaging industry.
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