Chun Jin, Alex Ang is a Silicon Packaging Design Engineer with experience at Intel Corporation since December 2019 and at Altera since January 2025. Chun Jin holds a Bachelor Degree of Electrical Engineering with a focus on Electrical Power from Universiti Tun Hussein Onn Malaysia, achieved in 2019 with a CGPA of 3.94.
Location
Bukit Mertajam, Malaysia
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