Bendy Cai is a seasoned Senior Site Technical Manager at Amazon, with a robust background in SMT and PCBA assembly processes. They have previously held key roles, such as Senior Supplier Quality Engineer at Cisco and Lead Engineer at Flextronics Shanghai. Bendy's expertise is highlighted by hands-on experience in manufacturing process management and quality assurance, and they continue to enhance their education at Soochow University. Bendy holds an MBA from Tongji University, completed in 2010.
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