Gangfeng Ye

Gangfeng Ye is a Senior Failure Analysis Engineer at Amazon, where they support various products and implement corrective actions through materials assessment and reliability testing. Previously, they held positions at InvenSense, where they led failure analysis for MEMS sensors, and three start-ups focused on discrete GaN power devices, where they significantly improved yield and contributed to patenting a new characterization technique. Gangfeng's earlier roles included being a TEM/FIB Engineer at NanoLab Technologies and a postdoctoral research fellow at Pennsylvania State University, where they worked on materials characterization for semiconductor fabrication. They earned a Bachelor’s and Master’s degree from Fudan University and a PhD from Michigan State University in Materials Science and Engineering.