Hong Yang is an ASIC Packaging Manager at Amazon, Project Kuiper, where they currently oversee packaging strategies. With over 20 years of experience in advanced IC Packaging technologies, they have previously held roles such as Senior IC Packaging Engineer at Amazon, Senior Principal Packaging Engineer at MaxLinear, and Principle Reliability Engineer at AMCC. Hong earned a Ph.D. in Materials Science and Engineering from North Carolina State University and completed a Leadership and Management Program at the University of California, San Diego. Their expertise encompasses product development, quality assurance, reliability testing, and material characterization.
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