Ling Cen

SoC Architect, project Kuiper

Ling Cen is a seasoned SoC architect at Cadence Design Systems, currently working on project Kuiper. With a foundation in Electrical Engineering from Kansas State University and a Bachelor's degree from Zhejiang University, Ling has held pivotal roles at notable companies, including Intel and Amazon. Previously, Ling was a lead engineer at Intel, where they contributed to the design of high-speed PCB boards for Xeon processors and led the development of the first tera-flop computer system boards. Throughout their career, Ling has earned multiple patents and has been instrumental in advancing system architecture across various organizations.

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Austin, United States

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