颜修平

修平 颜 is currently a Sr. Manufacturing Test Engineer at Amazon, focusing on enhancing production testing for various devices such as palm payment machines and sensors. Prior to this, 修平 worked at Huawei as a Senior Test Engineer, where they optimized functional testing processes and improved product yield using Lean Six Sigma methodologies. Their experience also includes a role as a Test Manager at Flex, leading teams in quality improvement initiatives for enterprise networking products. 修平 holds a Bachelor's degree in Electronic Information Science and Technology from Hunan University of Science and Technology, earned in 2008.