Renuka Soni

Senior Software Engineer

Renuka Soni is a Senior Software Engineer at Amazon, having transitioned from a Software Development Engineer II role at the company, where they worked from 2019 to 2023. Prior to Amazon, Renuka was a Senior Associate at Morgan Stanley (2013-2016), where they re-engineered the collateral aggregation process and implemented a Trader Dispute Tool using Java. Renuka began their career with an internship at NVIDIA, contributing to the development of stereoscopic 3D rendering techniques. They hold a Bachelor of Engineering in Computer Science from Vishwakarma Institute of Technology and a Master’s Degree in Computer Science from Stony Brook University.

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United States

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