SD

Sandeep D.

Technical Program Manager

Sandeep D. is a Technical Program Manager and Principal Engineer with over 15 years of experience in Sensors, Audio, RF, and Mixed-Signal products. They have held prominent roles at companies such as Qualcomm, where they served as Principal System Architect, leading projects related to ultrasonic fingerprint sensor ASIC design and Snapdragon chipset integration. Sandeep has also contributed to the field through their affiliation with IEEE as a Senior Member and has authored numerous publications alongside holding over 20 patents. Currently, they are pursuing a Master of Science in Electrical Engineering at Purdue University while simultaneously managing ASIC projects for Amazon's Project Kuiper.

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San Diego, United States

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