Tianchen Li is an embedded software engineer with extensive experience in firmware development and engineering. They held positions at Amazon and Amazon Lab126, where they currently serve as a Senior Embedded Software Engineer, contributing to the advancement of embedded devices. Previously, Tianchen worked at Broadcom Inc. as a Staff R&D Firmware Engineer and a Senior R&D Firmware Engineer, and has had roles at various organizations, including XPENG and Maxim Integrated. They earned a BS from Tongji University and an MS from Columbia University’s Fu Foundation School of Engineering and Applied Science.
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