William Liew is a Wireless DSP and System Engineer with extensive experience in the wireless industry. They worked as a Wireless DSP Engineer at Apple from 2018 to 2025, focusing on 4G/5G algorithm implementation. Prior to that, William held positions at Broadcom Limited and China Mobile, contributing to 2G, 3G, 4G, and 5G firmware algorithm development. Currently, they serve as a Senior Wireless DSP Engineer at Amazon and are pursuing a PhD from Queens University Canada and studies at Shanghai Jiao Tong University, while having previously held a Post Doctoral Fellowship in Electrical Engineering at Princeton University.
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