기열 양 is currently a 수석 at Amkor Technology, Inc., where they have worked since 2013, specializing in advanced packaging development, particularly in High Density Fan Out and 2.5/3D technology. They are also pursuing multiple graduate degrees in 신소재공학 and 신소재 at 국민대학교, having started their academic journey with a bachelor's degree in the same field.
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