Robert Lanzone is a seasoned executive with extensive experience in the semiconductor and packaging industries, currently serving as Corporate Vice President of the System in Package Business Unit at Amkor Technology, Inc. since September 2004. Lanzone has held multiple senior roles at Amkor, including Senior Vice President of System in Package Product Line and Advanced Wafer Level and Packaging Development, where responsibilities encompass advanced packaging technologies and strategic marketing. Previous experience includes leadership roles at ChipPAC as VP of Global Business Development, CEO of Coviant Inc., VP of Sales & Marketing at Unitive, General Manager of Advanced Technology Development at Kyocera, and Advisory Development Engineering Manager at IBM. Lanzone's educational background includes studies at New York University - Polytechnic School of Engineering.
This person is not in the org chart
This person is not in any teams
This person is not in any offices