Ed Lua is an experienced Assembly Process & Development Manager specializing in Optical and IC Packaging. With a Bachelor's degree in Materials Science Engineering from Nanyang Technological University, Ed has worked in various capacities, including at Micron Technology and Heptagon, where they led teams in advanced packaging processes and managed customer interactions. Currently at ams OSRAM, Ed oversees a team focused on meeting key performance indicators while mitigating risks in new product development. Ed holds four patents in advanced packaging and is known for expertise in quality tools and backend assembly techniques.
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