Jerold Lee is a seasoned technical engineer specializing in Semiconductor Assembly and Packaging, currently serving as the Component Engineering Senior Manager at Analog Devices. Jerold has held pivotal roles in the industry, including Principal Packaging Engineer at Broadcom and Manager of Assembly Technology & Engineering at Maxim Integrated. Their academic foundation includes a Bachelor of Science in Mechanical Engineering from San José State University, earned in 1995. With experience spanning both individual contributor and management roles, Jerold has developed a robust career in semiconductor technology.
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