Ming Cheng is a Packaging Engineer with a diverse background in structural mechanics and finite element analysis. They served as a Graduate Teaching Assistant at Stanford University, where they supported students in advanced mechanics courses. Previously, Ming worked as a Research Assistant at Tongji University, focusing on seismic behavior in mega-frame structures. At Maxim Integrated, they contributed to high-performance packaging solutions and new product introductions from 2012 to 2017 and currently holds a position as a Staff Engineer at Analog Devices. Ming has earned a Master’s Degree in Structural Mechanics from Stanford University and a Bachelor’s Degree in Civil Engineering from Tongji University.
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