Amy Xia is a Senior Thermal Engineer at Apple, currently applying their expertise in thermal and mechanical architecture within the semiconductors industry. They previously held roles at Intel Corporation from 2018 to 2023, where they served as a Hardware Program Architect and Senior Thermal/Mechanical Engineer, focusing on thermal design, validation, and optimization for server processors and ASICs. Earlier in their career, they worked as a Project Engineer at CDI and a System Support Engineer at Compaq Computer Co., Ltd. Amy earned a PhD in Mechanical Engineering from the University of Utah in 2005.
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