Chonghua Zhong is a Packaging Engineer at Apple, where they have served as the Microelectronic Packaging Engineering Manager since 2012. In this role, Chonghua drives package architectural definition and oversees various package developments, including 2.5D and 3D architectures. Prior to Apple, Chonghua worked at Broadcom as a Senior Principal Engineer, focusing on electronic packaging design and development, and began their career at Advanced Micro Devices as an IC Packaging Assembly Engineer. Chonghua holds two Master's degrees in Material, one from Shanghai Jiao Tong University and another from Nanyang Technological University Singapore.
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