Daniel Dai is an experienced engineering leader with a career spanning over 20 years in hardware, firmware, and software architecture. Currently an Engineering Program Manager at Apple, Daniel previously held roles as Engineering Director at Intel Corporation, where they successfully led a recovery for an ASIC Pre-Si Verification team, and as Sr. Manager of Firmware Engineering at Dell EMC, where they oversaw the development of enterprise SSDs. Daniel's educational background includes a Master of Science in Electrical and Electronics Engineering from Northwestern University and multiple degrees in Electrical Engineering from the University of California, Los Angeles. Passionate about customer-centric solutions and team empowerment, Daniel has a track record of driving operational efficiencies and building diverse engineering teams across global landscapes.
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