Jimin Yao is a Hardware Technology Engineer specializing in process engineering, material-process interactions, failure analysis, microfabrication, thin-film deposition and characterization, optical sensing, and colloidal sphere fabrication and self-assembly. They earned a Ph.D. from the University of Illinois at Urbana-Champaign, where they also conducted research from 2005 to 2010. Jimin worked at Intel Corporation from 2010 to 2014 as a Packaging R&D pathfinding and Senior Process Engineer, focusing on packaging materials and assembly development. Currently, Jimin is an IC packaging technologist at Apple since 2022.
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